목록 Heterogeneous Three-Dimensional Assembly of Metamaterials and Metadevices by Modular Transfer Printing Author Seungwoo Lee, Byungsoo Kang, Hohyun Keum, Alaa Alokaily, Hyun-Sung Park, Numair Ahmed, John A. Rogers, Placid M. Ferreira, Seok Kim, and Bumki Min Journal 제 4회 나노 임프린트 몰딩 프린트 학술대회 (NANO-IMP2015), 2015 Year 2009~2019